Chair: Lan-Da Van, National Chiao Tung University, Taiwan
Co-chair: Hongbin Sun, Xi'an Jiaotong University, China
Lan-Da Van -- (S'98-M'02-SM16) received the B.S. (Honors) and the M.S. degree from Tatung Institute of Technology, Taipei, Taiwan, in 1995 and 1997, respectively, and the Ph. D. degree from National Taiwan University (NTU), Taipei, Taiwan, in 2001, all in electrical engineering. From 2001 to 2006, he was an Associate Researcher at National Chip Implementation Center (CIC), Hsinchu, Taiwan. Since Feb. 2006, he joined the faculty of Department of Computer Science, National Chiao Tung University, Hsinchu, Taiwan, where he is currently an Associate Professor. His research interests are in learning computation algorithms, architectures, chips, systems and applications, where this includes the design of low-power/ high-performance/ cost-effective 3-D graphics processing system, adaptive/learning systems, computer arithmetic, filters, transforms, and AI IoT/M2M applications. He has published more than 60 journal and conference papers in these areas. Dr. Van was a recipient of the Chunghwa Picture Tube (CPT) and Motorola Fellowships in 1995 and 1997, respectively. He was an elected Chairman of the IEEE NTU Student Branch in 2000. In 2001, he has received the IEEE Award for outstanding leadership and service to the IEEE NTU Student Branch. He was a recipient of the Best Poster Award at iNEER Conference for Engineering Education and Research (iCEER) in 2005, the Teaching Award of the Computer Science College, National Chiao Tung University in 2014, and the Best Paper Award in the IEEE International Conference on Internet of Things (iThings2014) in 2014. Since 2009, he has been serving as the Officer of the IEEE Taipei Section. In 2014, he serves as a Track Co-Chair of the 22nd IFIP/IEEE International Conference on Very Large Scale Integration (VLSI-SoC). In 2016, he served as a Program Co-Chair of the NCTU Forum of Technology and Application of Internet of Things. He serves as a Track Co-Chair of the 2018 IEEE International Midwest Symposium on Circuits and Systems (MWSCAS) and a Special Session Co-Chair of the 2018 IEEE International Conference on DSP. He has been serving as an Associate Editor for the IEEE Transactions on Computers (2014~present), an Associate Editor for the IEEE Access (2018~present), an Associate Editor for the Journal of Medical Imaging and Health Informatics (2014~2017), and a Board Members of the Journal of Medical Imaging and Health Informatics (2017~present).
Hongbin Sun -- is currently a Professor in the School of Electrical and Information Egnieering at Xi'an Jiaotong University. He received the B.S. and Ph.D degrees in electrical engineering from the Xi'an Jiaotong University, China in 2003 and 2009, respectively. He worked as a Visiting Scholar at Rensselaer Polytechnic Institute during 2007-2008. He worked as a Post-doc at Xi'an Jiaotong University during 2009-2011. He joined the faculty of Xi'an Jiaotong University as an associate professor in 2011, and became a full professor in 2017. He is a member of IEEE. His current research interests are integrated circuit and system for computing, memory and video signal processing.